US 2007/0182023 A1 · Semiconductor device

Abstract

By making coefficients of linear thermal expansion of stress relief members on upper and lower surface sides of a semiconductor chip small, thermal strain on joint members above and below the semiconductor chip is decreased and development of a crack therein is suppressed to ensure a joint area. Furthermore, by making areas of electrodes and stress relief members large enough to include a project plane of the semiconductor chip projected onto the joint surfaces thereof, even if a crack develops into the joint member between the stress relief member and the electrode, a joint area larger than the area of the semiconductor chip can be ensured for a certain amount of time. As a result, a semiconductor device capable of simultaneously ensuring the joint areas of the respective joint members and preventing a decrease in heat release capability is provided.

Claims12

Dependent claims

A semiconductor device comprising:

a semiconductor chip having a rectification function;
a lead electrode having a header portion and is connected to a lead;
a case electrode;
a first stress relief member disposed between the semiconductor chip and the header portion;
a first joint member that joins the header portion and the first stress relief member together;
and
a second joint member that joins the semiconductor chip and the first stress relief member together, wherein
the first joint member has an area larger than an area of the semiconductor chip.

5 more elements

Dependencies are inferred from the claim text.

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims12