Semiconductor component comprising flip chip contacts and method for producing the same
AssigneeInfineon Technologies AG
InventorsMichael Bauer, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
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Abstract
A semiconductor component includes flip-chip contacts arranged on a wiring structure of a semiconductor chip. The wiring structure includes at least one metallization layer and at least one dielectric insulation layer made of a low-k material with a relative permittivity εr lower than the relative permittivity of a silicon dioxide. The flip-chip contacts are arranged on contact areas of an upper metallization layer and have a polymer core surrounded by a lead-free solder sheath.
Claims14
A semiconductor component, comprising:
- a semiconductor chip comprising a wiring structure including at least one metallization layer with contact areas and at least one dielectric insulation layer comprising a low-k material having a relative permittivity εr that is lower than the relative permittivity of a silicon oxide;
- and
- flip-chip contacts arranged on the contact areas of the metallization layer, the flip-chip contacts comprising a polymer core surrounded by a lead-free solder material.
A method for producing a semiconductor component comprising flip-chip contacts, comprising:
- producing a semiconductor chip including a wiring structure including at least one metallization layer with contact areas for the flip-chip contacts and at least one dielectric insulation layer comprising a low-k material having a relative permittivity εr lower than the relative permittivity of a silicon oxide;
- and
- applying the flip-chip contacts to the contact areas, the flip-chip contacts comprising a polymer core surrounded by a lead-free solder material.
Dependencies are inferred from the claim text.