Integrated circuit package system including zero fillet resin
AssigneeSTATS ChipPAC, Ltd.
InventorRajendra Pendse
Life of this patent
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Abstract
An integrated circuit packaging system comprised by providing a substrate with a first surface including conductive regions for receiving a flip chip die and a second surface including electrical contacts for external electrical connections. Providing the flip chip die over the substrate. Depositing a controlled volume of resin between the first surface of the substrate and the flip chip die and adhering the flip chip die to the first surface of the substrate to form the controlled volume of resin into a zero fillet resin.
Claims20
An integrated circuit packaging system for manufacturing an integrated circuit package comprising:
- providing a substrate with a first surface including conductive regions for receiving a flip chip die and a second surface including electrical contacts for external electrical connections;
- providing the flip chip die over the substrate;
- depositing a controlled volume of resin between the first surface of the substrate and the flip chip die;
- and
- adhering the flip chip die to the first surface of the substrate to form the controlled volume of resin into a zero fillet resin.
An integrated circuit packaging system for manufacturing an integrated circuit package comprising:
- providing a substrate with a bond finger on a first surface and solder ball connections on a second surface;
- providing a flip chip die;
- depositing a controlled volume of resin between the first surface of the substrate and the flip chip die;
- adhering the flip chip die to the first surface of the substrate to form the controlled volume of resin into a zero fillet resin;
- routing a zero fillet wire bond connection to connect to the medial bond finger region closest to the flip chip die;
- and
- depositing a molding compound.
An integrated circuit packaging system comprising:
- a flip chip die;
- a substrate with a first surface including conductive regions for receiving the flip chip die and a second surface including electrical contacts for external electrical connections;
- and
- a controlled volume of resin between the first surface of the substrate and the flip chip die, wherein the controlled volume of resin produces a zero fillet resin upon adhering the flip chip die to the first surface of the substrate.
Dependencies are inferred from the claim text.