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US 2007/0182010 A1Published application
Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
OwnerPaul Koninginventor
Life of this patent
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Abstract
A mounting substrate includes an imprinted structure on one side for containing electrical bumps. The imprinted structure is imprinted and also cured under conditions that allow retention of significant features of the cured polymer film. A chip package is also made of the imprinted structure. A computing system is also disclosed that includes the imprinted structure.
Claims10
1-26. (canceled)
A structure comprising:
- a substrate;
- an imprinted, cured polymer film disposed above the substrate, the polymer having a recess;
- and
- an electrical bump disposed in the recess.
1 more element
Dependencies are inferred from the claim text.