Methods of Forming Electronic Interconnections Including Compliant Dielectric Layers and Related Devices

Abstract

An electronic device may include a substrate with an input/output pad thereon, and a compliant dielectric layer on a first portion of the substrate such that a second portion of the substrate is free of the compliant dielectric layer. A conductive redistribution line may extend from the input/output pad to the compliant dielectric layer so that the compliant dielectric layer is between a bump pad portion of the conductive redistribution line and the substrate. A first solder bump may be on the bump pad portion of the conductive redistribution line so that the compliant dielectric layer is between the first solder bump and the substrate. A second solder bump may be on the second portion of the substrate that is free of the compliant dielectric layer. Related methods are also discussed.

Dependencies are inferred from the claim text.