Stackable Semiconductor Device and Method for Producing the Same

A method for producing a plurality of stackable semiconductor devices, each device including at least one first electrode disposed on a top side and a large-area second electrode on an underside of a semiconductor chip, the method comprising:

• producing a leadframe comprising:
• semiconductor device positions arranged in rows and/or columns, a lower leadframe half with lower through contact block halves, and an upper leadframe half with upper through contact block halves disposed in the semiconductor device positions, the halves being provided for through contact blocks on the edge sides of the semiconductor device, the leadframe further comprising at least one large-area external contact disposed in the semiconductor device positions for receiving a semiconductor chip;
• producing a plurality of semiconductor chips, each comprising at least one first electrode on a top side of the semiconductor chip and a large-area second electrode on an underside of the semiconductor chip;
• populating the lower leadframe half with semiconductor chips such that the large-area electrodes of the semiconductor chips are applied to the large-area external contacts in the semiconductor device positions of the leadframe half;
• aligning and applying the upper and lower leadframe halves such that the semiconductor chips are disposed between the leadframe halves;
• cohesively connecting the leadframe halves such that connections between the large-area and other electrodes to a plurality of through contact block halves of the edge regions in the semiconductor device positions of the leadframe form external contact blocks in the semiconductor device positions;
• connecting a control electrode to one of the through contact blocks of at least one edge side of the leadframe in the semiconductor device positions;
• packaging the semiconductor chips with the electrical connections in a plastic housing composition while leaving free edge side contact areas, top side contact areas and underside contact areas of the joined-together through contact block halves and also while leaving free the large-area external contact area;
• and
• separating the leadframe into individual stackable semiconductor devices.