Package structure of a microphone
OwnerChin-Ching Huang, Jiung-Yue Tien +1inventors
InventorsChin-Ching Huang, Jiung-Yue Tien, Hsi-Chen Yang
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Abstract
A kind of microphone package structure is disclosed. It comprises at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bounding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.
Claims26
A microphone package structure, comprising:
- a substrate, including plural bounding pads and a connective area, and these bounding pads and the connective area are located in the different planes;
- besides, the connective area is smeared with a conductive paste;
- a sound processing unit, set on the substrate, and connecting with plural bounding pads by plural wires;
- and
- an upper cap, located with the connective area of the substrate.
A microphone package structure, comprising:
- a substrate, including plural bounding pads and a connective area, and these bounding pads and the connective area are located in the different planes;
- besides, the connective area is smeared with conductive paste;
- a sound processing unit, set on the substrate, and connecting with plural bounding pads by plural wires, and
- an upper cap, located with the connective area of the substrate.
Dependencies are inferred from the claim text.