Module part
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsHiroshi Higashitani, Takeo Yasuho, Masaaki Hayama
Life of this patent
Estimating the term…
Abstract
A module component which includes circuit substrate 3 having one or more components 1 on at least one of the surfaces, and junction circuit substrate 5 having hollow 4, or hole, disposed corresponding to the portion of the one or more components 1 mounted on the one surface of circuit substrate 3 for fitting the mounted components 1 in. These substrates are laminated to form a single body so that mounted components 1 is contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.
Claims42
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A module component comprising
- one or more mounting components,
- one circuit substrate having the components mounted on at least one of the surfaces,
- another circuit substrate having the components mounted on at least one of the surfaces, and
- a junction circuit substrate disposed between the circuit substrates, which
- junction circuit substrate having either a hollow or a hole at the places corresponding to the components mounted on the opposing surfaces of the respective circuit substrates for fitting the components in, wherein
- the junction circuit substrate is provided with a connecting function, the respective circuit substrates and the junction circuit substrate are laminated into a single body and then cured so that the mounted components are contained within the module component.
A module component comprising
- one or more mounting components,
- a circuit substrate having the components mounted on at least one of the surfaces, and
- one junction circuit substrate having either a hollow or a hole at the places corresponding to the one or more components mounted on circuit substrate for fitting the mounted components in, wherein
- the junction circuit substrate is provided with a connecting function, the circuit substrate is sandwiched by the one junction circuit substrate and another junction circuit substrate to be laminated into a single body and then cured so that the mounted components are contained within the module component.
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12-14. (canceled)
28-72. (canceled)
Dependencies are inferred from the claim text.