Stacked integrated circuit package system with face to face stack configuration
AssigneeSTATS ChipPAC, Ltd.
InventorsJong-Woo Ha, Sang-Ho Lee, Soo-San Park
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Abstract
A stacked integrated circuit package system is provided forming a first molded chip comprises attaching a conductor on a wafer, applying an encapsulant around the conductor, and exposing a surface of the conductor in the encapsulant, attaching a first electrical interconnect on the conductor of the first molded chip and stacking an integrated circuit device on the first molded chip with an electrical connector of the integrated circuit device connected to the conductor of the first molded chip with the first electrical interconnect.
Claims20
A stacked integrated circuit package system comprising:
- forming a first molded chip comprises:
- attaching a conductor on a wafer,
- applying an encapsulant around the conductor, and
- exposing a surface of the conductor in the encapsulant;
- attaching a first electrical interconnect on the conductor of the first molded chip;
- and
- stacking an integrated circuit device on the first molded chip with an electrical connector of the integrated circuit device connected to the conductor of the first molded chip with the first electrical interconnect.
A stacked integrated circuit package system comprising:
- forming a first molded chip comprises:
- attaching conductors on an active side of a wafer,
- applying a top mold around the conductors on the active side,
- exposing a surface of the conductors in the top mold, and
- singulating integrated circuit dies from the wafer, the integrated circuit dies have the conductors surrounded by the top mold;
- attaching electrical interconnects on the conductors of the first molded chip;
- and
- stacking an integrated circuit device on the first molded chip with electrical connectors of the integrated circuit device connected to the conductors of the first molded chip with the electrical interconnects.
A stacked integrated circuit package system comprising:
- a first molded chip comprises:
- a conductor on an integrated circuit die,
- an encapsulant around the conductor, and
- a surface of the conductor in the encapsulant;
- a first electrical interconnect on the conductor of the first molded chip;
- and
- an integrated circuit device on the first molded chip with an electrical connector of the integrated circuit device connected to the conductor of the first molded chip with the first electrical interconnect.
Dependencies are inferred from the claim text.