Semiconductor device package with heat sink leadframe and method for producing it
AssigneeInfineon Technologies AG
InventorsMichael Ahr, Bakuri Lanchava
Life of this patent
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Abstract
Some embodiments have a semiconductor chip supported above a substrate, a filler layer encapsulating the semiconductor chip, a heat sink; and through contacts extending upwardly from the substrate nearly to an upper surface of the filler layer. In some embodiments of electronic packages, the through contacts separated from the heat sink by a trench cut into the upper surface of the filler layer, the through contacts intersecting one wall of the trench and the heat sink intersecting the other wall of the trench an electronic semiconductor package. A method of forming the package and a lead frame are also disclosed.
Claims21
Apparatus, comprising:
- a semiconductor chip supported above a substrate,
- a filler layer encapsulating the semiconductor chip,
- a heat sink;
- and
- through contacts extending upwardly from the substrate nearly to an upper surface of the filler layer;
- the through contacts separated from the heat sink by a trench cut into the upper surface of the filler layer, the through contacts intersecting one wall of the trench and the heat sink intersecting the other wall of the trench.
A method comprising:
- supporting the distal ends of extended fingers of a lead frame on the surface of a substrate, the fingers extending upwardly to support a body of the lead frame above an upper surface of a semiconductor chip (supported by the substrate);
- encapsulating the semiconductor chip and at least the portion of the extended fingers of the lead frame adjacent to the body of the lead frame to form a filler layer;
- and
- separating the extended fingers from the body of the lead frame.
A lead frame;
- comprising
- a generally planar body region;
- and
- a plurality of lateral fingers, each having a distal end and a connecting region between the distal end and the body, the distal end displaced from the from the planar body region.
Dependencies are inferred from the claim text.