Back to results
US 2007/0181993 A1Published application
Printed circuit board including reinforced copper plated film and method of fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Hoon Choi, Kwang-Su Yu, Hyo-Jae Bang, Dong-Chun Lee
Life of this patent
Estimating the term…
Abstract
A printed circuit board (PCB) may include a substrate. A copper layer may be formed over a portion of the substrate, the copper layer including at least one of a metallic powder and a ceramic powder.
Claims24
A PCB (printed circuit board), comprising:
- a substrate;
- a copper layer pattern formed over a portion of the substrate, the copper layer pattern including at least one of a metallic powder and a ceramic powder.
A method of fabricating a PCB (printed circuit board), comprising:
- forming a copper layer over a portion of a substrate, the copper layer including at least one of a metallic powder and a ceramic powder.
Dependencies are inferred from the claim text.