Microelectronic devices and methods for manufacturing microelectronic devices
AssigneeMicron Technology, Inc.
InventorRick Lake
Life of this patent
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Abstract
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an integrated circuit and a plurality of terminals operably coupled to the integrated circuit. The electrical couplers are attached to corresponding terminals on the die. The flowable material includes a plurality of spacer elements sized to space the die apart from another component. The flowable material may be a no-flow underfill, a flux compound, or other suitable material.
Claims64
A microelectronic device, comprising:
- a microelectronic die having an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
- a plurality of electrical couplers attached to corresponding terminals and projecting from the die;
- and
- a flowable material disposed on the die, wherein the flowable material comprises a plurality of spacer elements sized to space the die apart from another component by a distance that inhibits contact between the electrical couplers during a reflow process.
A microelectronic device, comprising:
- a microelectronic component having an active side and a plurality of terminals on the active side;
- a plurality of electrical couplers attached to corresponding terminals and projecting from the microelectronic component, the individual electrical couplers having a first dimension;
- and
- a flowable material disposed on the active side of the microelectronic component, the flowable material comprising a plurality of spacer elements having a second dimension at least 30% of the first dimension.
A microfeature workpiece, comprising:
- a plurality of microelectronic dies;
- a plurality of electrical couplers arranged in discrete arrays that are electrically coupled to corresponding microelectronic dies;
- and
- a flowable material disposed on the microelectronic dies, the flowable material comprising a plurality of spacer elements sized to correspond to a gap between the individual dies and other components to which the dies are attached such that the electric couplers are inhibited from contacting each other during a reflow process.
A microelectronic device, comprising:
- a microelectronic component having a plurality of terminals;
- a plurality of electrical couplers attached to corresponding terminals on the microelectronic component;
- a substrate having a plurality of contacts coupled to corresponding electrical couplers;
- and
- a flowable material between the microelectronic component and the substrate, the flowable material comprising a plurality of spacer elements with at least one spacer element contacting the microelectronic component and the substrate.
A microelectronic device, comprising:
- a first microelectronic die including an integrated circuit, a plurality of terminals operably coupled to the integrated circuit, and a plurality of conductive interconnects extending through the first die;
- a second microelectronic die including an integrated circuit and a plurality of terminals operably coupled to the integrated circuit;
- a plurality of electrical couplers between the first and second microelectronic dies and electrically connecting the terminals of the second die to corresponding interconnects of the first die;
- and
- a flowable material disposed between the first and second dies, the flowable material comprising a plurality of spacer elements sized to space the first and second dies apart by a gap.
A composition for use in a microelectronic device having a first component, a second component, and a plurality of electrical couplers extending between the first and second components, the composition comprising:
- a flowable binder having a first state in which the binder is flowable and a second state with a greater viscosity than the first state;
- and
- a plurality of spacer elements disposed within the flowable binder, the spacer elements being sized to space the first and second components apart by a minimum distance.
A method for manufacturing a microelectronic device having a microelectronic component and a plurality of electrical couplers with a first dimension attached to the component, the method comprising depositing a flowable material including a plurality of spacer elements onto the microelectronic component, the spacer elements having a second dimension at least 30% of the first dimension of the electrical couplers.
A method for manufacturing a microelectronic device, the method comprising:
- depositing a flowable material onto a first microelectronic component having a plurality of terminals, the flowable material including a plurality of spacer elements;
- attaching the first microelectronic component to a second microelectronic component with the flowable material positioned between the first and second microelectronic components and with a plurality of electrical couplers electrically connecting the terminals on the first microelectronic component to corresponding contacts on the second microelectronic component;
- and
- reflowing the electrical couplers such that at least one of the spacer elements contacts the first and second microelectronic components.
Dependencies are inferred from the claim text.