Bare chip embedded PCB and method of the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKyung-Jin Han, Hyung-Tae Kim, Moon-Il Kim, Jae-Kul Lee, Doo-Hwan Lee
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Abstract
A PCB having an embedded bare chip and a manufacturing method thereof are disclosed. A method of manufacturing a PCB may include embedding a bare chip in a board such that electrode pads of the bare chip are exposed, and forming electrode bumps on the electrode pads. In this way, the mass production system of a bare chip embedded PCB can be made to have a simplified process and low cost.
Claims10
A method of manufacturing a PCB (printed circuit board) having an embedded bare chip, the method comprising:
- embedding a bare chip in a board such that electrode pads of the bare chip are exposed;
- and
- forming electrode bumps on the electrode pads.
A method of manufacturing a PCB (printed circuit board) having an embedded bare chip, the method comprising:
- attaching a tape to one side of an insulated substrate having a penetration hole formed therein, and attaching the bare chip onto the tape inside the penetration hole such that electrode pads of the bare chip face the tape;
- filling up the penetration hole with a filler, and removing the tape;
- laminating a metal layer onto a surface of the filler and the insulated substrate from which the tape is removed;
- and
- forming electrode bumps by removing portions of the metal layer.
A PCB (printed circuit board) having an embedded bare chip, the PCB comprising:
- an insulated substrate having a penetration hole formed therein;
- a filler filling up an inside of the penetration hole;
- a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at the surface of the filler;
- and
- an electrode bump attached to a surface of the electrode pads.
Dependencies are inferred from the claim text.