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US 2007/0181982 A1Published application
Integrated circuit package system with leadfinger support
AssigneeSTATS ChipPAC, Ltd.
InventorsHenry Bathan, Zigmund Camacho, Arnel Trasporto, Jeffrey Punzalan
Life of this patent
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Abstract
An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
Claims20
An integrated circuit package system comprising:
- forming a leadframe having a lead with a leadfinger support of a predetermined height;
- and
- attaching an integrated circuit die with an electrical interconnect at a collapse height determined by the predetermined height of the leadfinger support.
An integrated circuit package system comprising:
- forming a leadframe having a lead with a leadfinger support of a predetermined height providing control of a collapse height and a wetting surface providing control of a spread distance;
- forming an integrated circuit die with an active surface having an electrical interconnect;
- aligning the electrical interconnect with the leadfinger support;
- and
- attaching the integrated circuit die on the leadframe at the collapse height and the spread distance.
2 more elements
An integrated circuit package system comprising:
- a leadframe having a lead with a leadfinger support of a predetermined height;
- and
- an integrated circuit die with an electrical interconnect at a collapse height determined by the predetermined height of the leadfinger support.
Dependencies are inferred from the claim text.