Semiconductor device with visible indicator and method of fabricating the same
OwnerJa-Young Choi, Hyung-Woo Kiminventors
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Abstract
A semiconductor device may include a fuse pattern and an interconnection pattern formed on a surface of a semiconductor substrate. An interlayer dielectric layer may be disposed on the surface of the semiconductor substrate including the fuse pattern and the interconnection pattern. A bonding pad may be formed over the interconnection pattern and connected to the interconnection pattern through the interlayer dielectric layer. A visible indicator may be formed in the interlayer dielectric layer near the bonding pad. The visible indicator may indicate a bonding region and a probing region of the bonding pad.
Claims19
A semiconductor device comprising:
- a fuse pattern and an interconnection pattern formed on a surface of a semiconductor substrate;
- an interlayer dielectric layer disposed on the surface of the semiconductor substrate including the fuse pattern and the interconnection pattern, the interlayer dielectric layer having a fuse opening formed in the interlayer dielectric layer that exposes the fuse pattern;
- a bonding pad formed over the interconnection pattern and connected to the interconnection pattern through the interlayer dielectric layer;
- and
- a visible indicator in the interlayer dielectric layer near the bonding pad, the visible indicator indicating a bonding region and a probing region of the bonding pad.
A method of fabricating a semiconductor device, comprising:
- forming an interconnection pattern and a fuse pattern on a surface of a semiconductor substrate;
- forming an interlayer dielectric layer on the surface of the semiconductor substrate including the interconnection pattern and the fuse pattern;
- patterning the interlayer dielectric layer to expose a portion of the interconnection pattern;
- forming a bonding pad connected to the exposed interconnection pattern;
- forming a fuse opening by removing a portion of the interlayer dielectric layer on the fuse pattern;
- and
- forming a visible indicator by removing a portion of the interlayer dielectric layer in the vicinity of the bonding pad.
Dependencies are inferred from the claim text.