Chip element, manufacturing method thereof, and electronic device or equipment using same
AssigneeTohoku University
InventorsTadahiro Ohmi, Akihiro Morimoto
Life of this patent
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Abstract
In a chip element having a substrate, an impedance element formed on the substrate, and a plurality of electrodes formed on the substrate to be connected to the impedance element, the substrate is formed of a low-permittivity material having a permittivity low enough to decrease the parasitic capacitance in a GHz range. The substrate further includes at least a synthetic resin and an inorganic compound.
Claims20
A chip element comprising:
- a substrate;
- an impedance element formed on the substrate;
- and
- a plurality of electrodes formed on the substrate to be connected to the impedance element;
- wherein the substrate is formed of a low-permittivity material having a permittivity low enough to decrease the parasitic capacitance in a GHz range, and the substrate further includes at least a synthetic resin and an inorganic compound.
Electronic device having a chip element comprising a substrate, an impedance element formed on the substrate, and a plurality of electrodes formed on the substrate to be connected to the impedance element,
- wherein the substrate of the chip element is formed of a low-permittivity material having a permittivity low enough to decrease the parasitic capacitance in a GHz range, and the substrate further includes at least a synthetic resin and an inorganic compound.
A method of manufacturing a chip element comprising the steps of:
- preparing a substrate;
- forming an impedance element on the substrate;
- and
- forming a plurality of electrodes on the substrate to be connected to the impedance element;
- wherein a low-permittivity material having a permittivity low enough to decrease the parasitic capacitance in a GHz range is used as the substrate, the substrate further including at least a synthetic resin and an inorganic compound.
Dependencies are inferred from the claim text.