Wafer encapsulated microelectromechanical structure and method of manufacturing same
OwnerAaron Partridge, Markus Lutz +1inventors
InventorsAaron Partridge, Markus Lutz, Pavan Gupta
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.
Claims38
1-30. (canceled)
A microelectromechanical device comprising:
- a first substrate;
- a chamber;
- an inert gas disposed in the chamber;
- a microelectromechanical structure, wherein the microelectromechanical structure is (i) formed from a portion of the first substrate and (ii) at least partially disposed in the chamber;
- a second substrate, bonded to the first substrate, wherein a surface of the second substrate forms a wall of the chamber;
- and
- a contact, wherein:
- a first portion of the contact is (i) formed from a portion of the first substrate and (ii) at least a portion thereof is disposed outside the chamber;
- and
- a second portion of the contact is formed from a portion of the second substrate.
A microelectromechanical device comprising:
- a first substrate, wherein the first substrate includes a first material and an insulation layer disposed thereon;
- a chamber;
- an inert gas disposed in the chamber;
- a microelectromechanical structure, wherein the microelectromechanical structure is (i) formed from a portion of the first substrate and (ii) at least partially disposed in the chamber;
- a second substrate, bonded to the first substrate, wherein a surface of the second substrate forms a wall of the chamber;
- and
- a cavity (i) formed in the insulation layer and (ii) forming a portion of the chamber.
A microelectromechanical device comprising:
- a first substrate;
- a chamber;
- an inert gas disposed in the chamber;
- a microelectromechanical structure, wherein the microelectromechanical structure is (i) formed from a portion of the first substrate and (ii) at least partially disposed in the chamber;
- a second substrate, bonded to the first substrate, wherein a surface of the second substrate forms a wall of the chamber;
- a trench, disposed in the second substrate;
- and
- an isolation region, disposed in or on the first substrate and aligned with the trench.
Dependencies are inferred from the claim text.