Novel Isolated LDMOS IC Technology
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Ren Tsai, Chen-Fu Hsu
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Ren Tsai, Chen-Fu Hsu
Estimating the term…
A lateral double diffused metal oxide semiconductor (LDMOS) device includes a gate to control the device, a drain coupled to the gate formed in a well of a first type, a source to form a current path with the drain, and a first field oxide region disposed between the gate and the drain. The gate is formed over a first portion of the well of the first type and a channel portion of the well of the second type. The LDMOS also includes a second field oxide region, which is disposed between the edges of the drain and the well of the second type. A dummy polysilicon layer, which is formed to cover approximately one half of the second field oxide with a remaining portion of the dummy polysilicon layer covering a second portion of the well of the second type, reduces the electric field in the drift region.
A metal oxide semiconductor (MOS) device comprising:
The device of claim 4, wherein the reduction in the length of the drift region causes an approximate 20 percent reduction in size of the LDMOS device.
A method for reducing length of a drift region of a metal oxide semiconductor (MOS) device, the method comprising:
Dependencies are inferred from the claim text.