Electronic module and method of producing the electronic module

An electronic module, comprising:

• a heat sink comprising an upper surface and a lower surface, wherein the lower surface provides an outer contact area of the electronic module;
• a plurality of leads arranged adjacent the heat sink;
• at least one control semiconductor chip mounted on the upper surface of the heat sink,
• at least one circuit element, wherein each circuit element comprises two vertical semiconductor power switches arranged in a stack and configured to provide a half-bridge circuit, wherein
• a first vertical semiconductor power switch is a n-type semiconductor power switch having a first surface comprising at least one anode and at least one control electrode and having a second surface comprising at least one cathode, and wherein
• a second vertical semiconductor power switch is a n-type semiconductor power switch having a first surface comprising at least one anode and at least one control electrode and having a second surface comprising at least one cathode;
• wherein the anode of the second vertical semiconductor power switch is mounted on the cathode of the first vertical semiconductor power switch by a first electrically conductive layer, the first electrically conductive layer providing a node defining an output, and
• wherein the anode of the first vertical semiconductor power switch of each of the circuit elements is mounted on the upper surface of the heat sink by a second electrically conductive layer, the lower surface of the heat sink providing the ground contact area of the electronic module, and wherein
• the control electrode of the first vertical semiconductor power switch and the control electrode of the second vertical semiconductor power switch of each circuit element are electrically connected to, and controllable by, the control semiconductor chip, and wherein,
• the node is electrically connected to an output lead and the cathode of the second vertical semiconductor power switch is electrically connected to an input lead,
• wherein the electronic module comprises two control semiconductor chips, a first vertical semiconductor control chip being a control electrode driver and a second vertical semiconductor control chip being a pulse width modulator, wherein the control electrode driver chip is mounted on the pulse wave modulator chip, the pulse wave modulator chip being mounted on the heat sink.

An electronic module, comprising:

• a heat sink comprising an upper surface and a lower surface, wherein the lower surface provides an outer contact area of the electronic module;
• a plurality of leads arranged adjacent the heat sink;
• at least one control semiconductor chip mounted on the upper surface of the heat sink,
• at least one circuit element, wherein each circuit element comprises two vertical semiconductor power switches arranged in a stack and configured to provide a half-bridge circuit, wherein
• a first vertical semiconductor power switch is a p-type semiconductor power switch having a first surface comprising at least one cathode and at least one control electrode and having a second surface comprising at least one anode, and wherein
• a second vertical semiconductor power switch is a p-type semiconductor power switch having a first surface comprising at least one cathode and at least one control electrode and having a second surface comprising at least one anode;
• wherein the anode of the second vertical semiconductor power switch is mounted on the cathode of the first vertical semiconductor power switch by a first electrically conductive layer, the first electrically conductive layer providing a node defining an output, and
• wherein the anode of the first vertical semiconductor power switch of each of the circuit elements is mounted on the upper surface of the heat sink by a second electrically conductive layer, the lower surface of the heat sink providing the ground contact area of the electronic module, and wherein
• the control electrode of the first vertical semiconductor power switch and the control electrode of the second vertical semiconductor power switch of each circuit element are electrically connected to, and controllable by, the control semiconductor chip, and wherein,
• the node is electrically connected to an output lead and the cathode of the second vertical semiconductor power switch is electrically connected to an input leads
• wherein the electronic module comprises two control semiconductor chips, a first vertical semiconductor control chip being a control electrode driver and a second vertical semiconductor control chip being a pulse width modulator, and
• wherein the control electrode driver chip is mounted on the pulse wave modulator chip, the pulse wave modulator chip being mounted on the heat sink.

A method to assemble an electronic module, comprising:

• providing a heat sink comprising an upper surface and a lower surface, wherein the lower surface provides an outer contact area of the electronic module;
• providing a plurality of leads arranged adjacent the heat sink;
• providing at least two vertical semiconductor power switches, each having at least one cathode, at least one anode and at least one control electrode;
• attaching the anode of at least one first vertical semiconductor power switch to the upper surface of the heat sink by a second electrically conductive layer, and
• attaching the anode of a second vertical semiconductor power switch to the cathode of each of the first vertical semiconductor power switches by a first electrically conductive layer to provide a circuit element having a half-bridge configuration and to provide a node providing an output,
• wherein the lower surface of the heat sink provides the ground contact area of the electronic module.