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US 2007/0181903 A1Published application
Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
AssigneeSharp Kabushiki Kaisha
InventorHideya Takakura
Life of this patent
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Abstract
A semiconductor device manufacturing method includes the steps of filling a cavity and a resin reservoir hole in a lower metal mold with a liquid-state resin, holding a semiconductor element between the lower metal mold and an upper metal mold, injecting the resin in the resin reservoir hole into the cavity to seal the semiconductor device with the resin. Thus, the semiconductor device having almost no voids and less material loss is manufactured with high accuracy.
Claims15
A semiconductor device manufacturing method comprising:
- a first step of filling a cavity formed in a lower metal mold and a resin reservoir hole formed in the lower metal mold and connected to the cavity with a liquid-state resin;
- a second step of holding a semiconductor element between the lower metal mold and an upper metal mold;
- and
- a third step of sealing the semiconductor element with the resin by injecting the resin of the resin reservoir hole into the cavity.
1 more element
A semiconductor device manufacturing apparatus comprising:
- a lower metal mold having a cavity and a resin reservoir hole directly connected to the cavity;
- an upper metal mold relatively coming close to or away from the lower metal mold and holding a semiconductor element together with the lower metal mold;
- a filling device filling the cavity and the resin reservoir hole in the lower metal mold with a liquid-state resin;
- and
- an injection member placed in the resin reservoir hole so as to reciprocate in the resin reservoir hole and injecting the resin of the resin reservoir hole into the cavity by extruding the resin into the cavity with use of the injection member.
2 more elements
Dependencies are inferred from the claim text.