Transparent epoxy resin composition for molding optical semiconductor and optical semiconductor integrated circuit device using the same
AssigneesNEC Electronics Corporation, Nitto Denko Corporation
InventorsKenji UCHIDA, Koki Hirasawa, Katsumi Shimada, Shinjiro Uenishi, Shinya Ota
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Abstract
In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: R1: a hydrogen atom (—H), an alkyl group, or a phenyl group R2: an alkyl group (—CH3, —C2H5, —C3H7)
Claims8
A transparent epoxy resin composition for molding an optical semiconductor, comprising following components (A) to (D), in an optical semiconductor integrated circuit device including a lead frame:
- (A) an epoxy resin;
- (B) a curing agent;
- (C) a thiol;
- and
- (D) an amine-based curing catalyst represented by following Chemical Formula 1:
- R1:
- a hydrogen atom (—H), an alkyl group, or a phenyl group
- R2:
- an alkyl group (—CH3, —C2H5, —C3H7)
Dependencies are inferred from the claim text.