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US 2007/0181901 A1Published application
Power surface mount light emitting die package
AssigneeCree, Inc.
InventorBan Loh
Life of this patent
Estimating the term…
Abstract
A light emitting die (LED) package is provided which includes a substrate having traces, a LED mounted on the substrate and connected to the traces, and an encapsulant covering the LED. The package includes a lens sitting on the encapsulant and substantially covering the LED. The lens is free to move relative to the substrate.
Claims17
A light emitting die package, comprising:
- a substrate having traces,
- a light emitting diode (LED) mounted on the substrate and connected to the traces,
- an encapsulant covering the LED, and
- a lens sitting on the encapsulant and substantially covering the LED, the lens free to move relative to the substrate.
1 more element
A light emitting die package, comprising:
- a substrate including traces for connecting to an LED chip on the substrate, and
- an encapsulant covering the LED chip, and
- a lens covering the LED chip and sitting on the encapsulant, the lens free to move as the encapsulant expands and contracts.
Dependencies are inferred from the claim text.