High heat dissipating package baseplate for a high brightness LED

Abstract

A high heat dissipating package baseplate for a high brightness LED, wherein a package baseplate manufacturing process includes a baseplate manufacturing process, a wiring manufacturing process and a package manufacturing process. An arc concavity is formed in a surface of a heat dissipating piece, and a light reflecting layer having light gathering effectiveness is made to cover a surface of the concavity. A light-emitting diode is disposed on the light reflecting layer, a printed circuit board is disposed on the heat dissipating piece, making a package baseplate finished product. The heat from the light-emitting diode is directly conducted away through the heat dissipating piece serving as a thermal conducting medium, thereby shortening the path that heat dissipation must pass through, which increases speed and improves effectiveness of heat dissipation. Moreover, such a configuration is dissimilar to any cup-shaped attachment method of prior art used as a thermal conduction means.

Dependencies are inferred from the claim text.