Semiconductor device

A semiconductor device comprising:

• a semiconductor integrated circuit;
• an antenna comprising a conductive layer that is electrically connected to the semiconductor integrated circuit;
• at least one substrate provided to cover the semiconductor integrated circuit and the conductive layer;
• and
• an adhesive for bonding the semiconductor integrated circuit and the at least one substrate,
• wherein the adhesive contains a composition including a conductive polymer.

A semiconductor device comprising:

• a semiconductor integrated circuit;
• an antenna comprising a conductive layer that is electrically connected to the semiconductor integrated circuit;
• and
• a layer covering the semiconductor integrated circuit,
• wherein the layer covering the semiconductor integrated circuit contains a conductive polymer.

A semiconductor device comprising:

• a semiconductor integrated circuit;
• an antenna comprising a conductive layer that is electrically connected to the semiconductor integrated circuit;
• and
• a layer covering the semiconductor integrated circuit and the antenna,
• wherein the layer covering the semiconductor integrated circuit and the antenna contains a conductive polymer.

A semiconductor device comprising:

• a semiconductor integrated circuit;
• a connection terminal electrically connected to the semiconductor integrated circuit;
• a layer covering a part of the connection terminal, which is formed over the semiconductor integrated circuit;
• a substrate provided with an antenna that comprises a conductive layer;
• and
• an anisotropic conductive adhesive including a conductive particle for electrically connecting the connection terminal and the antenna, and for bonding the substrate and the semiconductor integrated circuit,
• wherein the layer covering a part of the connection terminal contains a conductive polymer.

A semiconductor device comprising:

• a semiconductor integrated circuit;
• a connection terminal electrically connected to the semiconductor integrated circuit;
• a substrate provided with an antenna that comprises a conductive layer;
• a layer covering a part of the antenna;
• and
• an anisotropic conductive adhesive including a conductive particle for electrically connecting the connection terminal and the antenna, and for bonding the substrate and the semiconductor integrated circuit,
• wherein the layer covering a part of the antenna contains a conductive polymer.

A semiconductor device comprising:

• a semiconductor integrated circuit;
• a connection terminal electrically connected to the semiconductor integrated circuit;
• a substrate provided with an antenna that comprises a conductive layer;
• and
• an anisotropic conductive adhesive including a conductive particle for electrically connecting the connection terminal and the antenna, and for bonding the substrate and the semiconductor integrated circuit,
• wherein the anisotropic conductive adhesive contains a composition including a conductive polymer.