Semiconductor device and manufacturing method of the same
AssigneeFujitsu Limited
InventorsKazuhiro Yoshimoto, Yuzo Shimobeppu, Kazuo Teshirogi, Yoshiaki Shinjo
Life of this patent
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Abstract
A semiconductor device, includes a semiconductor substrate having a main surface where a light receiving element area is formed; a projection part provided in the periphery of the light receiving element area on the main surface of the semiconductor substrate; an adhesive material layer provided in the external periphery of the projection part on the main surface of the semiconductor substrate; and a transparent plate supported by the projection part and fixed above the light receiving element area by the adhesive material layer.
Claims16
A semiconductor device, comprising:
- a semiconductor substrate having a main surface where a light receiving element area is formed;
- a projection part provided in the periphery of the light receiving element area on the main surface of the semiconductor substrate;
- an adhesive material layer provided in the external periphery of the projection part on the main surface of the semiconductor substrate;
- and
- a transparent plate supported by the projection part and fixed above the light receiving element area by the adhesive material layer.
A manufacturing method of a semiconductor device, comprising the steps of:
- forming a light receiving element area on a main surface of a semiconductor substrate;
- providing a projection part and an adhesive material layer in the periphery of the light receiving element area on the main surface of the semiconductor substrate;
- and
- supporting a transparent plate above the light receiving element area by the projection part and fixing the transparent plate by the adhesive layer.
A manufacturing method of a semiconductor device, comprising the steps of:
- forming a plurality of light receiving element areas on a main surface of a semiconductor substrate;
- providing a plurality of projection parts and a plurality of adhesive material layers in the periphery of the light receiving element areas on the main surface of the semiconductor substrate;
- supporting a transparent plate above the light receiving element areas by the projection parts and fixing the transparent plate by the adhesive layers;
- and
- cutting the semiconductor substrate and the transparent plate so as to make pieces of the semiconductor substrate and the transparent plate.
Dependencies are inferred from the claim text.