Automated package dimensioning subsystem
AssigneeMetrologic Instruments, Inc.
InventorsXiaoxun Zhu, Ka Au, Gennady Germaine, George Kolis, Timothy Good, Michael Schnee, Robert Blake, Carl Knowles, Sankar Ghosh, Charles Naylor, David Wilz, Constantine Tsikos, Francis Lodge, Stephen Colavito, George Rockstein
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