Wave solder apparatus
AssigneeQuanta Computer Inc.
InventorsWen-Chi Chen, Jauwhei Hong
Life of this patent
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Abstract
A wave solder apparatus. A conveyer carries a circuit board. A solder tank is disposed under the conveyer and includes a turbulent nozzle and a laminar nozzle separated therefrom. The turbulent nozzle includes a plurality of turbulent spouting holes. The ratio of the cross-sectional area of the turbulent spouting holes to that of the turbulent nozzle exceeds 0.377. A first heater is disposed under the conveyer and adjacent to the solder tank, heating the bottom surface of the circuit board. A second heater is disposed above the conveyer and opposes the first heater, heating the top surface of the circuit board.
Claims3
A wave solder apparatus, comprising:
- a conveyer carrying a circuit board;
- a solder tank disposed under the conveyer and comprising a turbulent nozzle and a laminar nozzle separated therefrom, wherein the turbulent nozzle comprises a plurality of turbulent spouting holes, and the ratio of the cross-sectional area of the turbulent spouting holes to that of the turbulent nozzle exceeds 0.377;
- a first heater disposed under the conveyer and adjacent to the solder tank, heating the bottom surface of the circuit board;
- and
- a second heater disposed above the conveyer and opposing the first heater, heating the top surface of the circuit board.
Dependencies are inferred from the claim text.