Magnetic alignment of integrated circuits to each other
OwnerLynne Michaelson, Robert Jones +1inventors
InventorsLynne Michaelson, Robert Jones, Scott Pozder
Life of this patent
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Abstract
Utilizing magnetic features located on different structures having semiconductor devices to align the structures when contacting the structures together. The magnetic features on each structure are of opposite polarity and provide magnetic forces for alignment of the structures. The magnetic forces can also be used to sense position and move the structures into an aligned position. In some examples, the structures include die with semiconductor devices. In one example, the structures are wafers with multiple die. In other examples, one of the structures is a die and the other is a wafer.
Claims22
A method comprising:
- forming a first structure, the first structure including semiconductor material;
- forming a second structure, the second structure including semiconductor material;
- contacting the first structure with the second structure, wherein the contacting further includes:
- sensing forces generated by magnetic fields between the first structure and the second structure;
- and
- aligning the first structure with respect to second structure based on the sensing.
A method comprising:
- forming a first structure, the first structure including a semiconductor device, the first structure including a first magnetic feature and a second magnetic feature;
- forming a second structure, the second structure including a second semiconductor device, the second structure including a third magnetic feature and a fourth magnetic feature;
- and
- contacting the first structure with the second structure to provide the first structure and the second structure in a contacted position with each other, wherein in the contacted position, the first magnetic feature is magnetically coupled to the third magnetic feature and the second magnetic feature is magnetically coupled to the fourth magnetic feature.
An apparatus comprising:
- a first die, the first die including a first semiconductor device, the first die including a first magnetic feature and a second magnetic feature;
- and
- a second die, the second die including a second semiconductor device, the second die is attached to the first die, the second die including a third magnetic feature and a fourth magnetic feature, the first magnetic feature is magnetically coupled to the third magnetic feature and the second magnetic feature is magnetically coupled to the fourth magnetic feature.
Dependencies are inferred from the claim text.