Component mounting method and component mounting apparatus

A component mounting method comprising the steps of:

• holding an electronic component (1) formed with a plurality of protruded electrodes (1a) with a suction nozzle (11) set in a placement head (3) that is controlled to move up and down, while a substrate (4) formed with a plurality of substrate electrodes (4a) is held on a mounting stage (25);
• lowering the placement head so that the protruded electrodes make contact with the substrate electrodes;
• and applying heat to melt the protruded electrodes to bond both electrodes together to mount the electronic component on the substrate,
• wherein the method including the steps of:
• lowering the placement head so that the protruded electrodes make contact with the substrate electrodes;
• moving up the placement head by an amount that makes up for thermal expansion that occurs in the placement head and in the mounting stage when they heat up;
• applying heat to a preset temperature to melt and fuse the protruded electrodes with the substrate electrodes;
• stopping heating to cool down and solidify the molten parts;
• and releasing suction applied to the electronic component from the suction nozzle and moving up the placement head.

A component mounting method comprising the steps of:

• holding an electronic component (1) formed with a plurality of protruded electrodes (1a) with a suction nozzle (11) set in a placement head (3) that is controlled to move up and down, while a substrate (4) formed with a plurality of substrate electrodes (4a) is held on a mounting stage (25);
• lowering the placement head so that the protruded electrodes make contact with the substrate electrodes;
• and applying heat to melt the protruded electrodes to bond both electrodes together to mount the electronic component on the substrate,
• wherein the method including the steps of:
• lowering the placement head so that the protruded electrodes make contact with the substrate electrodes;
• applying heat to a preset temperature to melt and fuse the protruded electrodes with the substrate electrodes;
• stopping heating and moving down the placement head by an amount that makes up for contraction that occurs in the placement head and in the mounting stage when they cool down;
• and after the molten parts have solidified, releasing suction applied to the electronic component from the suction nozzle and moving up the placement head.

A component mounting method comprising the steps of:

• holding an electronic component (1) formed with a plurality of protruded electrodes (1a) with a suction nozzle (11) set in a placement head (3) that is controlled to move up and down, while a substrate (4) formed with a plurality of substrate electrodes (4a) is held on a mounting stage (25);
• lowering the placement head so that the protruded electrodes make contact with the substrate electrodes;
• and applying heat to melt the protruded electrodes to bond both electrodes together to mount the electronic component on the substrate,
• wherein the method including the steps of:
• detecting contact load when the placement head is lowered and the protruded electrodes make contact with the substrate electrodes;
• lowering the suction nozzle to a position where a preset contact load is detected;
• moving up the placement head by an amount that makes up for thermal expansion that occurs in the placement head and in the mounting stage when they heat up;
• applying heat to a preset temperature to melt and fuse the protruded electrodes with the substrate electrodes;
• stopping heating to cool down and solidify the molten parts;
• and after the molten parts have solidified, releasing suction applied to the electronic component from the suction nozzle and the placement head is moved up.

A component mounting method comprising the steps of:

• holding an electronic component (1) formed with a plurality of protruded electrodes (1a) with a suction nozzle (11) set in a placement head (3) that is controlled to move up and down, while a substrate (4) formed with a plurality of substrate electrodes (4a) is held on a mounting stage;
• lowering the placement head so that the protruded electrodes make contact with the substrate electrodes;
• and applying heat to melt the protruded electrodes to bond both electrodes together to mount the electronic component on the substrate,
• wherein the method including the steps of;
• detecting contact load when the placement head is lowered and the protruded electrodes make contact with the substrate electrodes;
• lowering the suction nozzle to a position where a preset contact load is detected;
• applying heat to a preset temperature to melt and fuse the protruded electrodes with the substrate electrodes;
• stopping heating and moving down the placement head by an amount that makes up for contraction that occurs in the placement head and in the mounting stage when they cool down;
• and after the molten parts have solidified, releasing suction applied to the electronic component from the suction nozzle and moving up the placement head.

A component mounting method comprising the steps of:

• holding an electronic component (1) formed with a plurality of protruded electrodes (1a) with a suction nozzle (11) set in a placement head (3) that is controlled to move up and down, while a substrate (4) formed with a plurality of substrate electrodes (4a) is held on a mounting stage (25);
• lowering the placement head so that the protruded electrodes make contact with the substrate electrodes;
• and applying heat to melt the protruded electrodes to bond both electrodes together to mount the electronic component on the substrate,
• wherein the method including the steps of:
• detecting contact load when the placement head is lowered and the protruded electrodes make contact with the substrate electrodes;
• lowering the suction nozzle to a position where a preset contact load is detected;
• moving up the placement head by an amount that makes up for thermal expansion that occurs in the placement head and in the mounting stage when they heat up;
• applying heat to a preset temperature to melt and fuse the protruded electrodes with the substrate electrodes;
• stopping heating and moving down the placement head by an amount that makes up for contraction that occurs in the placement head and in the mounting stage when they cool down;
• and after the molten parts have solidified, releasing suction applied to the electronic component from the suction nozzle and moving up the placement head.

A component mounting apparatus, wherein an electronic component (1) formed with a plurality of protruded electrodes (1a) is held with a suction nozzle (11) set in a placement head (3), while a substrate (4) formed with a plurality of substrate electrodes (4a) is held on a mounting stage (25);

• the placement head is controlled to move up and down and lowered so that the protruded electrodes make contact with the substrate electrodes;
• and heat is applied to melt the protruded electrodes to bond both electrodes together to mount the electronic component on the substrate,
• wherein the apparatus comprising:
• a detecting unit (14) for detecting contact load when the placement head is lowered and the protruded electrodes make contact with the substrate electrodes;
• and a control unit (6) for controlling the up and down movement of the placement head so that the contact load detected by this contact load detecting unit reaches a preset level, for controlling the placement head in its lowered position to move up by an amount in accordance with thermal expansion that occurs in the placement head and in the mounting stage when they heat up, and for controlling the placement head to move down by an amount that makes up for contraction that occurs in the placement head and in the mounting stage when they cool down after heating is stopped.