Electrode, electronic component and substrate
AssigneeFujitsu Limited
InventorYoshiyuki Hiroshima
Life of this patent
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Abstract
The present invention is an electrode 10 so provided as to be soldered to an electronic component 12 and, when the electronic component 12 is mounted on a substrate 13, soldered to the substrate 13. The electrode 10 includes a column-like electrode body 11 soldered to the electronic component 12 and to the substrate 13. The electrode has grooves as an air discharging device discharging the air 15a in air voids 15 generated within the solder 14 between joint surfaces 11a, 11b of the electrode body 11 and the electronic component 12 or the substrate 13 when the electrode body 11 is soldered to the electronic component 12 or the substrate 13.
Claims9
An electrode so provided as to be soldered to an electronic component and, when the electronic component is mounted on a substrate, soldered to the substrate, comprising
- a column-like electrode body soldered to the electronic component and to the substrate;
- and
- an air discharging device discharging the air in air voids generated within the solder between a joint surface of the electrode body and the electronic component or the substrate when the electrode body is soldered to the electronic component or the substrate.
An electronic component so mounted as to be soldered to a substrate, comprising an electrode soldered to the electronic component.
- wherein the electrode includes a column-like electrode body soldered to the electronic component and to the substrate,
- wherein the column-like electrode body includes an air discharging device discharging the air in air voids generated within the solder between a joint surface of the electrode body and the electronic component or the substrate when the electrode body is soldered to the electronic component or the substrate.
A substrate mounted with an electronic component including a soldered electrode,
- the electronic component being mounted by soldering the electrode,
- the electrode comprising a column-like electrode body;
- and
- an air discharging device discharging the air in air voids generated within the solder between a joint surface of the electrode body and the electronic component or the substrate when the electrode body is soldered to the electronic component or the substrate.
Dependencies are inferred from the claim text.