Lead-free solder reworking system and method thereof

Abstract

A lead-free solder reworking method. A solder tank including a nozzle and containing molten lead-free solder is provided. A printed circuit board assembly is placed on the solder tank. The printed circuit board assembly has a printed circuit board and a first electronic member. The printed circuit board has at least one through hole. The first electronic member has at least one first pin soldered in the through hole by lead-free solder. The through hole and first pin are located above the nozzle. A reworking temperature and a reworking time are established. The printed circuit board is heated until the temperature thereof reaches the reworking temperature. The nozzle outputs the molten lead-free solder from the solder tank to the through hole of the printed circuit board until the nozzle operates for the reworking time.

Dependencies are inferred from the claim text.