Elastic interface for wafer bonding apparatus
AssigneeInnovative Micro Technology
InventorDavid Erlach
Life of this patent
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Abstract
An apparatus for bonding a lid wafer to a device wafer includes an elastic interface having a first surface and a second surface. Relieved areas may be created in the elastic interface by removing at least some of the elastic material of the interface, leaving a mesh with nodes. Raised areas may be disposed on the nodes in staggered positions on the first surface relative to the second surface. The bonding pressure deflects the raised features on the first surface in one direction and the raised features on the second surface in another direction. The restoring force of the mesh transmits the pressure through the interface and to a lid wafer and a device wafer, to bond the lid wafer to the device wafer.
Claims20
An elastic interface for use in a wafer bonding tool, comprising:
- a first surface;
- a second surface;
- and
- a plurality of raised features disposed on the first and second surfaces, with the raised features on the first surface disposed in a staggered position with respect to the raised features on the second surface.
A method for bonding a device wafer to a lid wafer, comprising:
- applying pressure from a pressure device to an elastic interface;
- deflecting a plurality of raised features on a first surface of the elastic interface in a first direction with the pressure;
- deflecting a plurality of raised features on a second surface of the elastic interface in a second direction with the pressure;
- and
- transmitting the pressure to a lid wafer and a device wafer through the elastic interface.
An apparatus for making an elastic interface, comprising:
- means for forming a first surface;
- means for forming a second surface;
- and
- means for forming a plurality of raised features on the first and second surfaces, with the raised features on the first surface disposed in a staggered position with respect to the raised features on the second surface.
Dependencies are inferred from the claim text.