Heat treatment apparatus, heat treatment method, and computer readable storage medium

Abstract

In the present invention, a plurality of heat treatment units are arranged side by side in a linear form and a substrate transfer mechanism for transferring the substrate between the heat treatment units is provided in a heat treatment apparatus. The substrate is sequentially heat-treated in the arrangement order, whereby one heat treatment as a whole is dividedly and successively performed in the plurality of heat treatment units. This allows substrates to be heat-treated along the same route and uniforms the thermal history among the substrates. At the time when heat-treating a plurality of substrates the present invention causes less variation in thermal history among the substrates as compared to the case of parallel heat treatments.

Dependencies are inferred from the claim text.