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US 2007/0181555 A1Published application
Method and apparatus for leak-proof mounting of a liquid cooling device on an integrated circuit
AssigneeOnscreen Technologies, Inc.
InventorsWilliam Clough, Franz Schuette
Life of this patent
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Abstract
Apparatus for cooling of an electrical circuit element on an electrical element package, comprising in combination, structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with said element, a rotatably tightenable connection between said package and said hollow body, and acting to block leakage of cooling fluid from said cavity.
Claims10
Apparatus for cooling of an electrical circuit element on an electrical element package, comprising in combination
- a) structure including a hollow body defining a cavity for containing cooling fluid located in heat transfer relation with said element,
- b) a rotatably tightenable connection between said package and said hollow body, and acting to block leakage of cooling fluid from said cavity.
Dependencies are inferred from the claim text.