Laser-based material processing systems and methods for using such systems
AssigneeUniversal Laser Systems, Inc.
InventorsYefim Sukhman, Christian Risser
Life of this patent
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Abstract
Laser-based material processing systems and methods for using such systems are disclosed herein. In one embodiment, for example, a laser-based material processing system includes a workpiece support, a positioning assembly over at least a portion of the workpiece support, and a laser. The system also includes a laser beam director carried by the positioning assembly to direct a beam generated by the laser toward the workpiece support. The system further includes a dispensing unit carried by the positioning assembly to discharge a material toward the workpiece support. The dispensing unit can be configured to discharge a number of different materials onto a workpiece carried by the workpiece support.
Claims37
A laser-based material processing system, the system comprising:
- a workpiece support;
- a positioning assembly over at least a portion of the workpiece support;
- a laser;
- a laser beam director carried by the positioning assembly to direct a beam generated by the laser toward the workpiece support;
- and
- a dispensing unit carried by the positioning assembly to discharge a material toward the workpiece support.
A laser-based material processing system, the system comprising:
- a radiation source configured to produce a high-intensity radiation beam and direct the radiation beam along a radiation path toward a workpiece support;
- a positioning assembly over at least a portion of the workpiece support, the positioning assembly including an arm configured to move along a first axis, wherein the arm extends along a second axis generally normal to the first axis;
- a laser beam director carried by the positioning assembly and including one or more optical elements in the radiation path to direct the radiation beam toward the workpiece support;
- and
- a dispensing unit carried by the positioning assembly to discharge a material toward the workpiece support.
A laser-based system for processing workpieces, the system comprising:
- a gantry-style support assembly over a workpiece;
- a laser beam director carried by the support assembly and positioned to direct a laser beam to the workpiece to modify the workpiece;
- and
- a dispensing unit carried by the support assembly and configured to deposit a material onto the workpiece.
A material processing system, comprising:
- radiation means for directing a radiation beam along a radiation path toward a workpiece;
- support means over at least a portion of the workpiece;
- beam positioning means carried by the support means, the beam positioning means including optical elements in the radiation path to direct the radiation beam to the workpiece such that the beam irradiates the workpiece;
- and
- dispensing means carried by the support means, the dispensing means positioned to deposit a material onto the workpiece.
A method for processing a workpiece, the method comprising:
- irradiating a portion of a workpiece with a laser beam positioned by a beam director carried at least in part by a support assembly over the workpiece;
- and
- depositing a material onto the workpiece with a dispensing unit carried by the support assembly.
A method for manipulating workpieces, the method comprising:
- mounting a workpiece to a workpiece support;
- impinging a laser on the workpiece while the workpiece is on the workpiece support to modify the workpiece;
- and
- depositing a material onto the workpiece with a dispensing unit separate from the laser while the workpiece is on the workpiece support.
Dependencies are inferred from the claim text.