Electronic device with protection panel, protection panel, and method of fabricating protection panels

A protection panel for electronic device display window comprising:

• a transparent protection panel main body an upper surface of which is provided with a transparent lower electrode and a lower circuit provided around the transparent lower electrode;
• a movable electrode film in which a transparent upper electrode provided in a position opposite to the transparent lower electrode sin the protection panel main body and an upper circuit provided around the transparent upper electrode so as to be covered by a decoration layer are provided on a lower surface of a transparent resin film, on at least one side of which the decoration layer having a transparent window section and covering the lower circuit is formed, and in which peripheral portions thereof are bonded and arranged on the transparent protection panel main body such that an air layer is formed on an upper side of the protection panel main body;
• and
• a cover film which is made of a transparent-resin and is provided on an upper surface of the transparent resin film, and on at least one surface of which the decoration layer is formed;
• whereby
• the protection panel is fitted and retained in a panel fitting section having an opening in a casing, in a manner without a gap and such that outer surfaces of the protection panel and the casing are flush with each other, so that a display device, which is located on a lower side of the protection panel and arranged so as to be visually recognizable from an outside through the transparent window section, is protected.

A method of fabricating protection panels for electronic device display window, comprising:

• forming a plurality of transparent lower electrodes and a plurality of lower circuits provided around the transparent lower electrodes, on an upper surface of a transparent plate member;
• forming transparent upper electrodes provided in positions opposite to the transparent lower electrodes and upper circuits formed around the transparent upper electrodes, on a lower surface of a transparent resin film, on at least one side of which decoration layer are formed so as to mask respective lower circuits, each decoration layer having a transparent window sections;
• bonding the plate member and the transparent resin film in such a manner that peripheral portions of the transparent lower electrodes and the said transparent upper electrodes are bonded together while an air layer is formed on an upper side of the plate member, and bonding a transparent-resin made cover film to the transparent resin film so as to bring into the transparent-resin made cover film of which the decoration layers, each of which has the transparent window section and masks each upper circuit and each lower circuit, are formed on at least one surface, into an opposite of the transparent resin film surface which is provided on an upper surface of said transparent resin film and on which the transparent upper electrodes are provided;
• and
• cutting together the plate member, the transparent resin film, and the cover film having been bonded, in an outside of the transparent lower electrodes and the transparent upper electrodes and along an inner periphery of the decoration layer, so that protection panels are obtained.