Electrode and pad assembly for processing conductive layers
AssigneeNovellus Systems, Inc.
InventorsBulent Basol, Jeffrey Bogart
Life of this patent
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Abstract
An electrode assembly includes a distribution plate having a plurality of grooves that communicate with openings in an overlying polishing pad layer. The grooves include end openings that allow for draining of process solution, both during processing and subsequent cleaning/rinsing of the pad. Drainage occurs continually during processing, cleaning and rinsing, and so is constricted through the end openings relative to the grooves, to prevent wastage. The end openings are sufficiently large, however, to substantially completely drain fluids from the grooves between steps without delaying robotic motions.
Claims23
An apparatus for use in electropolishing a conductive surface of a wafer utilizing a process solution, comprising:
- a distribution plate comprising a first surface and a second surface;
- at least one groove formed in the first surface to distribute the process solution thereon, the at least one groove including at least one opening extending between the at least one groove and the second surface to flow a process solution into the at least one groove, wherein the at least one groove includes an end opening configured to drain fluid from the at least one groove;
- and
- a polishing pad is attached on the first surface to polish the conductive surface using the process solution distributed by the at least one groove.
A method of electropolishing a conductive surface by utilizing an assembly and a process solution, comprising:
- supplying a process solution to a first surface of a distribution plate and distributing the solution in grooves formed therein;
- flowing the process solution from the groove through a pad towards the conductive surface;
- draining the process solution from end openings of the grooves;
- and
- applying the pad to the conductive surface while electropolishing the conductive surface.
Dependencies are inferred from the claim text.