Use of a hotmelt adhesive, pasty fixation compound for micro devices and detector for detecting ionizing radiation

A pasty fixation compound for micro devices comprising at least the following constituents:

• a powdered hotmelt adhesive;
• an anti-flow additive for producing at least one of a thixotropic and pseudoplastic property;
• and
• a solvent for the anti-flow additive which does not make the hotmelt adhesive dissolve and which does not make the hotmelt adhesive swell.

A method of fixing at least one micro device on a carrier, the method comprising:

• applying a hotmelt adhesive to a carrier, the surface area covered by the at least one micro device on the carrier only being covered partly by the hotmelt adhesive;
• positioning the at least one micro device at a predetermined distance, forming a gap, from the carrier until a solid adhesive bond has been produced between the at least one micro device and the carrier by cooling the hotmelt adhesive;
• and
• filling the gap by an epoxy resin and curing of the epoxy resin.

A detector for detecting ionizing radiation, comprising:

• a multiplicity of detector elements, disposed in a two-dimensional arrangement and defining a local resolution of the detector, the detector elements being constructed from a pasty fixation compound comprising at least the following constituents:
• a powdered hotmelt adhesive;
• an anti-flow additive for producing at least one of a thixotropic and pseudoplastic property;
• and
• a solvent for the anti-flow additive which does not make the hotmelt adhesive dissolve and which does not make the hotmelt adhesive swell.