Junction substrate and method of bonding substrates together
AssigneeCasio Computer Co., Ltd.
InventorsOsamu NAKAMURA, Keishi Takeyama, Tsutomu Terazaki
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Abstract
A junction substrate includes a first substrate, a buffer film formed on one surface of the first substrate, a metal containing film formed on the buffer film and having a lower resistance than the buffer film, and a second substrate bonded to the other surface of the first substrate.
Claims10
A method of bonding a plurality of substrates together to obtain a junction substrate, the method comprising:
- forming a heating resistant film with a predetermined pattern on a buffer film formed on one surface of a first substrate;
- abutting the first substrate against a second substrate at the other surface of the first substrate which is opposite said one surface on which the buffer film is formed;
- and
- applying a voltage so that the first substrate operates as a negative electrode while the second substrate operates as a positive electrode, to anodically bond the first and second substrates together.
A method of bonding a plurality of substrates together to obtain a junction substrate, the method comprising:
- forming an interconnect film with a predetermined pattern which supplies power to a heating resistant film formed on one surface of a first substrate;
- abutting the first substrate against a second substrate at the other surface of the first substrate which is opposite the surface on which the heating resistant film is formed;
- and
- applying a voltage so that the first substrate operates as a negative electrode while the second substrate operates as a positive electrode, to anodically bond the first and second substrates together.
A method of bonding a plurality of substrates together to obtain a junction substrate, the method comprising:
- forming a heating resistant film on a buffer film formed on one surface of a first substrate;
- forming an interconnect film with a predetermined pattern on the heating resistant film, through which power is to be supplied to the heating resistant film;
- abutting the first substrate against a second substrate at the other surface of the first substrate which is opposite the surface on which the buffer film is formed;
- and
- applying a voltage so that the first substrate operates as a negative electrode while the second substrate operates as a positive electrode, to anodically bond the first and second substrates together.
Dependencies are inferred from the claim text.