Photosensitive epoxy resin adhesive composition and use thereof
AssigneeNitto Denko Corporation
InventorMiho Yamaguchi
Life of this patent
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Abstract
A photosensitive epoxy resin adhesive composition which is capable of forming a pattern by exposure to light through a photomask and development, and which, even after having formed a pattern in that manner, may still exhibit high adhesiveness when heated while keeping its pattern as such, as well as a photosensitive adhesive film which comprises the photosensitive epoxy resin adhesive composition, The photosensitive epoxy resin adhesive composition comprises an epoxy resin and a photo-acid generator, wherein the epoxy resin comprises a polyfunctional epoxy resin having an epoxy equivalent of from 100 to 300 g/eq and a polyfunctional epoxy resin having an epoxy equivalent of from 450 to 10000 g/eq.
Claims18
1-7. (canceled)
A method of bonding comprising:
- applying a photosensitive epoxy resin adhesive composition to a first adhered;
- exposing the photosensitive epoxy resin adhesive composition to light through a photomask;
- developing the photosensitive epoxy resin adhesive composition to form a pattern so as to have a void space;
- applying a second adherend on the patterned photosensitive epoxy resin adhesive composition;
- and
- subjecting the first and second adherends to thermal compression;
- wherein the photosensitive epoxy resin adhesive composition comprises an epoxy resin comprising a first polyfunctional epoxy resin having an epoxy equivalent of from 100 to 300 g/eq and a second polyfunctional epoxy resin having an epoxy equivalent of from 450 to 10000 g/eq, and an photo-acid generator.
Dependencies are inferred from the claim text.