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US 2007/0181153 A1Published application
Semiconductor substrate cleaning method and semiconductor substrate cleaning machine
AssigneePanasonic Corporation
InventorsKenji Kobayashi, Hiroshi Oshita
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Abstract
A semiconductor substrate cleaning method includes a first cleaning step of cleaning the surface of a semiconductor substrate with the use of a first brush and a second cleaning step of cleaning the surface of the semiconductor substrate with the use of a second brush after the first cleaning step. The second cleaning step is performed under a condition that suppresses recontamination of the surface of the semiconductor substrate in comparison with the first cleaning step.
Claims15
A semiconductor substrate cleaning method comprising:
- a first cleaning step of cleaning the surface of a semiconductor substrate with the use of a first brush;
- and
- a second cleaning step of cleaning, after the first cleaning step, the surface of the semiconductor substrate with the use of a second brush under a condition that suppresses recontamination of the surface of the semiconductor substrate in comparison with the first cleaning step.
A semiconductor substrate cleaning machine comprising:
- a first brush for cleaning the surface of a semiconductor substrate;
- and
- a second brush for cleaning the surface of the semiconductor substrate,
- wherein cleaning by the second brush is performed under a condition that suppresses recontamination of the surface of the semiconductor substrate in comparison with the first cleaning step.
1 more element
Dependencies are inferred from the claim text.