Cleaning Solution and Cleaning Method of a Semiconductor Device
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Yong KIM, Sang-Jun Choi, Chang-Ki Hong
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Abstract
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. Accordingly, the foreign bodies can be substantially removed from the surface of the substrate without corroding a metal.
Claims11
A method of removing foreign bodies from a surface of a thin film formed on a substrate during a process for fabricating a semiconductor device, comprising:
- forming an oxide layer by oxidizing the surface of the thin film;
- and
- removing the oxide layer.
A cleaning method comprising:
- treating a substrate with an aqueous solution comprising an oxidizer;
- rinsing the substrate with deionized water to remove the aqueous solution comprising the oxidizer;
- drying the substrate;
- and
- treating the substrate with a solution comprising a surface charge controlling agent, a fluorine based deoxidizer and deionized water.
Dependencies are inferred from the claim text.