Single wafer backside wet clean
OwnerAlexander Ko, Glen Egami +2inventors
InventorsAlexander Ko, Glen Egami, Billy Suber, Konstantin Smekalin
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Abstract
A method and apparatus for cleaning a backside of a substrate is disclosed. The method includes placing the substrate parallel to a platter, wherein the backside of the substrate is facing a top side of the platter in a spaced apart relation, thus defining a gap therebetween. Subsequently, a liquid is flowed through the platter and into continuous contact with the entire backside of the substrate and the top side of the platter.
Claims21
A method for cleaning a backside of a substrate, comprising:
- placing a substrate parallel to a platter, wherein a backside of the substrate is facing a top side of the platter in a spaced apart relation, thus defining a gap therebetween;
- and
- flowing a liquid through the platter and into continuous contact with the top side of the platter and the entire backside of the substrate.
A method for cleaning a backside of a substrate, comprising:
- placing a substrate parallel to a platter having a top side and a bottom side, wherein a backside of the substrate is spaced apart from the top side of the platter, thereby forming a gap between the backside of the substrate and the top side of the platter;
- and
- filling the gap with a cleaning liquid provided through the platter.
A method for cleaning a backside of a substrate, comprising:
- placing a substrate parallel to a platter having a top side and a bottom side, wherein the backside of the substrate is facing the top side of the platter in a horizontal orientation;
- spacing the backside of the substrate approximately 3.0 to 4.0 millimeters from the top side of the platter;
- and
- flowing a cleaning liquid through the platter into continuous contact with the entire backside of the substrate and the top side of the platter.
Dependencies are inferred from the claim text.