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US 2007/0181062 A1Published application
Semiconductor device manufacturing apparatus including temperature measuring unit
OwnerIl-Kyoung Kim, Kwang-Myung Lee +3inventors
InventorsIl-Kyoung Kim, Kwang-Myung Lee, No-Hyun Huh, Wan-Goo Hwang, Ki-Young Yun
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Abstract
A semiconductor device manufacturing apparatus comprises a chamber for processing a wafer, a wafer loading unit configured to load a wafer into and out of the chamber, a heating unit coupled with a chamber wall and a temperature measuring unit located between the chamber wall and the wafer loading unit and apart from the chamber wall.
Claims20
A semiconductor device manufacturing apparatus comprising:
- a chamber for processing a wafer;
- a wafer loading unit configured to load a wafer into and out of the chamber;
- a heating unit coupled with a chamber wall;
- and
- a temperature measuring unit located between the chamber wall and the wafer loading unit and apart from the chamber wall.
2 more elements
A chamber for manufacturing a semiconductor device, the chamber comprising:
- a chamber wall forming an enclosed area;
- a gas inlet port disposed on a first surface of the chamber wall to introduce gases;
- a gas dispersing unit located adjacent to the gas inlet port to disperse gases introduced through the gas inlet port;
- a wafer loading unit for loading a wafer;
- a heating unit for heating inside the chamber;
- a temperature measuring unit located to be apart from the chamber wall between the chamber wall and the wafer loading unit to measure a temperature inside the chamber;
- and
- a gas outlet port disposed on a second surface of the chamber wall to discharge gases.
5 more elements
Dependencies are inferred from the claim text.