Resonant-oscillating-device fabrication method
AssigneeBrother Kogyo Kabushiki Kaisha
InventorsKenichi Murakami, Nobuaki Asai
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Abstract
There is provided a resonant-oscillating-device fabrication method comprising a thickness measurement step of measuring a thickness of a substrate, a piezoelectric-layer formation condition determination step of determining conditions of forming a piezoelectric layer to bring frequency of resonant oscillation of an oscillating element to a desired resonant frequency in accordance with the thickness of the substrate measured in the thickness measurement step, and a piezoelectric-element formation step of forming the piezoelectric element in accordance with the piezoelectric-layer formation conditions determined in the piezoelectric-layer formation condition determination step.
Claims15
A resonant-oscillating-device fabrication method for integrally forming a structure comprising a support, a beam vibratably extending from the support, and an oscillating element which is supported by the beam so as to oscillate in resonance with the vibration of the beam, by using a substrate, and forming at the beam a piezoelectric element for driving the beam into vibration by a structure having a piezoelectric layer between two electrodes, the resonant-oscillating-device fabrication method comprising:
- a thickness measurement step of measuring the thickness of the substrate;
- a piezoelectric-layer formation condition determination step of determining conditions of forming the piezoelectric layer to bring the frequency of resonant oscillation of the oscillating element to a desired resonant frequency in accordance with the thickness of the substrate measured in the thickness measurement step;
- and
- a piezoelectric-element formation step of forming the piezoelectric element in accordance with the piezoelectric-layer formation conditions determined in the piezoelectric-layer formation condition determination step.
A resonant-oscillating-device fabrication method for integrally forming a structure comprising a support, a beam vibratably extending from the support, and an oscillating element which is supported by the beam so as to oscillate in resonance with the vibration of the beam at a desired resonant frequency, by using a substrate, the resonant-oscillating-device fabrication method comprising:
- a thickness measurement step of measuring the thickness of the substrate;
- an etching condition determination step of determining conditions of etching a portion forming the beam in the substrate to provide the desired resonant frequency, in accordance with the thickness of the substrate measured in the thickness measurement step;
- and
- an etching step of etching the substrate in accordance with the etching conditions.
Dependencies are inferred from the claim text.