Polyimide film having high adhesiveness and method for producing same
AssigneeKaneka Corporation
InventorsHisayasu Kaneshiro, Hiroyuki Tsuji, Takashi Kikuchi
Life of this patent
Estimating the term…
Abstract
A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.
Claims13
A non-thermoplastic polyimide film comprising:
- a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide.
A non-thermoplastic polyimide film comprising:
- a non-thermoplastic polyimide resin having at least one residue unit derived from a compound having diamine functionality and at least one residue unit derived from a compound having acid dianhydride functionality,
- wherein either the residue unit derived from a compound having diamine functionality or the residue unit derived from a compound having acid dianhydride functionality has at least one amic acid group and exhibits a thermoplastic character when bound linearly using pyromellitic acid dianhydride (in the case of the compound having diamine functionality) or p-phenylenediamine (in the case of the compound having acid dianhydride functionality) and then imidized.
A non-thermoplastic polyimide film comprising:
- a non-thermoplastic polyimide resin having at least one residue unit derived from a compound having diamine functionality and at least one residue unit derived from a compound having acid dianhydride functionality,
- wherein either the residue unit derived from a compound having diamine functionality or the residue unit derived from a compound having acid dianhydride functionality has at least one imide group and exhibits a thermoplastic character when bound linearly using pyromellitic acid dianhydride (in the case of the compound having diamine functionality) or p-phenylenediamine (in the case of the compound having acid dianhydride functionality) and then imidized.
A non-thermoplastic polyimide film made from monomer components polymerized in an arrangement that provides thermoplastic polyimide regions having the following properties as compared to a comparative film having the same monomer components that are randomly polymerized:
- i) the non-thermoplastic polyimide film has an elasticity modulus higher than that of the comparative film by at least 0.3 GPa;
- ii) the non-thermoplastic polyimide film has a linear expansion coefficient and moisture expansion coefficient smaller than those of the comparative film by at least 1 ppm;
- iii) the non-thermoplastic polyimide film and the comparative film maintain substantially the same tensile elongation;
- iv) the storage elasticity modulus of the non-thermoplastic polyimide film at 380° C. determined by dynamic viscoelasticity analysis is lower than that of the comparative film by at least 0.1 GPa;
- and
- v) the tan δ peak value of the non-thermoplastic polyimide film is larger than that of the comparative film by at least 0.01.
Dependencies are inferred from the claim text.