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US 2007/0179232 A1Published application
Thermal Interface Material
AssigneeNational Starch and Chemical Investment Holding Corporation
InventorsAndrew Collins, Chih-Min Cheng
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Abstract
A composition for use as a thermal interface material in a heat-generating electronic device is provided. The composition comprises a blend of acrylic polymer, one or more liquid resins, conductive filler particles and optionally one or more solid resins.
Claims18
A thermally conductive composition for transferring heat, comprising acrylic polymer, one or more liquid resins and optionally one or more solid resins, and thermally conductive particles.
Dependencies are inferred from the claim text.