Flame-retarding and thermosetting resin composition
AssigneeChang Chun Plastics Co., Ltd.
InventorsKuen Hwang, Hong Chen, Bao Horng
Life of this patent
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Abstract
The present invention relates to a thermosetting resin composition, which comprises at least one titanium compound copolymerized composite as filler and can be used as mechanical, electrical and electronic parts, molded and/or packaging resin for semiconductor and so on, etc. By adding such titanium compound copolymerized composite, the resin composition of the present invention improves flame retardance and heat resistance and has an excellent moldability and reliance under circumstances without adding any other flame-resisting material.
Claims18
A thermosetting resin composition, which comprises at least one titanium compound copolymerized composite as filler and a thermosetting resin.
A thermosetting epoxy resin composition, which comprises an epoxy resin, a curing agent, a curing promoter, and a titanium compound copolymerized composite as filler, wherein the epoxy equivalent weight of said epoxy resin to the active hydrogen equivalent of said curing agent is in ratio of from 1:0.5 to 1:1.5, and the amount of said curing promoter is from 0.01 to 5% by weight based on the total weight of said epoxy resin composition, and the amount of said titanium compound copolymerized composite is from 1 to 25% by weight based on the total weight of said epoxy resin composition.
A thermosetting phenolic resin composition, which comprises 20 to 60% by weight of phenolic resin, 2 to 12% by weight of curing agent, 1 to 8% by weight of curing promoter, and 35 to 75% by weight of inorganic filler in which a titanium compound copolymerized composite comprises from 0.15 to 30% by weight of the inorganic filler, wherein the % by weight is based on the total weight of the resin composition.
Dependencies are inferred from the claim text.