Cleaning formulations
OwnerMadhukar Rao, Thomas Wieder +2inventors
InventorsMadhukar Rao, Thomas Wieder, John Marsella, Mark Listemann
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Abstract
The present invention relates to an aqueous cleaning composition used to remove unwanted organic and inorganic residues and contaminants from semiconductor substrates. The cleaning composition comprises a urea derivative such as, for example, dimethyl urea, as the component that is principally responsible for removing organic residues from the substrate. A fluoride ion source is also included in the cleaning compositions of the present invention and is principally responsible for removing inorganic residues from the substrate. The cleaning compositions of the present invention have a low toxicity and are environmentally acceptable.
Claims43
A composition useful for removing residue from a semiconductor substrate comprising in effective cleaning amounts:
- a) water;
- b) at least one compound of formula (I):
- wherein,
- R1 and R3 are independently hydrogen, C1-C4 alkyl, or C1-C4 alkylol;
- and
- R2 and R4 are independently C1-C4 alkyl, or C1-C4 alkylol;
- c) a fluoride ion source;
- d) optionally a water-miscible organic solvent;
- e) optionally a buffering agent;
- and
- f) optionally a corrosion inhibitor.
A cleaning composition useful for removing residue from a semiconductor substrate comprising:
- a) from about 10.0% by wt. to about 90.0% by wt. of water;
- b) from about 2.0% by wt. to about 75.0% by wt. of a compound of formula (I):
- wherein,
- R1 and R3 are independently hydrogen, C1-C4 alkyl, or C1-C4 alkylol;
- and
- R2 and R4 are independently C1-C4 alkyl, or C1-C4 alkylol;
- c) from about 0.1% by wt. to about 5.0% by wt. of a fluoride ion source;
- d) optionally from about 10.0% by wt. to about 75.0% by wt. of at least one water-miscible organic solvent;
- e) optionally from about 0.2% by wt. to about 30.0% by wt. of a buffering agent;
- and
- f) optionally from about 0.01% by wt. to about 5.0% by wt. of a corrosion inhibitor.
A method for removing residue from a substrate, the method comprising the steps of:
- contacting the substrate with a cleaning composition comprising:
- a) from about 10.0% by wt. to about 90.0% by wt. of water;
- b) from about 2.0% by wt. to about 75% by wt. of a compound of formula
- wherein,
- R1 and R3 are independently hydrogen, C1-C4 alkyl, or C1-C4 alkylol;
- and
- R2 and R4 are independently C1-C4 alkyl, or C1-C4 alkylol;
- c) from about 0.1% by wt. to about 5.0% by wt. of a fluoride ion source;
- d) optionally from about 10.0% by wt. to about 75.0% by wt. of at least one water-miscible organic solvent;
- e) optionally from about 0.2% by wt. to about 30.0% by wt. of a buffering agent;
- and
- f) optionally from about 0.01% by wt. to about 5.0% by wt. of a corrosion inhibitor;
- rinsing the cleaning composition from the substrate;
- and
- drying the substrate.
Dependencies are inferred from the claim text.