Wire saw ingot slicing system and method with ingot preheating, web preheating, slurry temperature control and/or slurry flow rate control
AssigneeMEMC Electronic Materials, Inc.
InventorsPuneet Gupta, Milind Kulkarni, Carlo Zavattari, Roland Vandamme
Life of this patent
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Abstract
A system and method for slicing an ingot into wafers using the wire saw process. A slurry collection system collects and supplies slurry to a slurry handling system for controlling temperatures and/or flow rates of the slurry thereby providing slurry output at a controlled temperature and/or a controlled flow rate to slicing system for cutting the ingot, which may be preheated.
Claims28
A system for cutting an ingot comprising:
- A slurry;
- A cooling system for cooling the slurry;
- A heating system for heating the slurry;
- A wire saw for cutting the ingot and having an ingot holder port for receiving a mixture of the heated slurry and the cooled slurry and having a wire-web port for receiving a mixture of the heated slurry and the cooled slurry.
A system for cutting an ingot comprising:
- A slurry collection system for collecting and supplying slurry;
- A slurry handling system connected to the slurry collection system for controlling temperature and/or flow rate of the slurry and having a first output port providing slurry at a first temperature and/or a first flow rate and having a second output port providing slurry at a second temperature and/or a second flow rate;
- A wire saw for cutting the ingot having a first port for receiving the first slurry output and applying it to the wire saw at a first location and having a second port for receiving the second slurry output and applying it to the wire saw at a second location.
A system for cutting an ingot comprising:
- A slurry collection system for collecting and supplying slurry;
- A slurry handling system connected to the slurry collection system for controlling temperature and/or flow rate of the slurry and having a slurry output port providing slurry output at a controlled temperature and/or a controlled flow rate;
- and
- A wire saw for cutting the ingot having a port for receiving the slurry output from the slurry output port of the slurry handling system and applying it to the wire saw.
A method for cutting an ingot comprising:
- collecting and supplying slurry;
- controlling temperature or flow rate of the slurry and providing slurry output at a controlled temperature and/or a controlled flow rate;
- cutting the ingot with a wire slicing system while supplying the slurry output to the wire slicing system.
A system for cutting an ingot comprising:
- A slurry;
- A slurry temperature control system for controlling a temperature of the slurry;
- An ingot heating system for heating the ingot;
- and
- A wire saw for cutting the ingot and having one or more ports for receiving the temperature controlled slurry and applying it to the ingot and/or saw as the ingot is cut by the wire saw.
A system for cutting an ingot comprising:
- A slurry collection system for collecting and supplying slurry;
- A slurry handling system connected to the slurry collection system for controlling temperature or flow rate of the slurry;
- An ingot heating system for preheating the ingot to a preset temperature before cutting;
- A wire saw for cutting the preheated ingot having one or more ports for receiving the slurry at controlled temperature and/or controlled flow rate and applying it to the ingot and/or saw as the ingot is cut by the wire saw.
A system for cutting an ingot comprising:
- A slurry collection system for collecting and supplying slurry;
- A slurry handling system connected to the slurry collection system for controlling temperature or flow rate of the slurry and having a slurry output port providing slurry output at a controlled temperature and/or a controlled flow rate;
- An ingot preheating system for controlling the ingot temperature;
- and
- A wire saw for cutting the ingot having a port for receiving the slurry output from the slurry output port of the slurry handling system and applying it to the wire saw.
A method for cutting an ingot comprising:
- collecting and supplying slurry;
- controlling delivery of the slurry and providing slurry output;
- controlling the temperature of the ingot;
- cutting the ingot with a wire slicing system while supplying the slurry output to the wire slicing system.
A system for cutting an ingot comprising:
- A slurry collection system for collecting and supplying slurry;
- A slurry handling system connected to the slurry collection system for controlling temperature and flow rate of the slurry and having a first output port providing slurry at a first temperature and a first flow rate, having a second output port providing slurry at a second temperature and a second flow rate and having a third output port providing slurry at a third temperature and a third flow rate;
- A wire saw including an ingot holder and a wire web for cutting the ingot wherein the wire saw has a first port for receiving the first slurry output, wherein the wire web has a front port for receiving the second slurry output and wherein the wire web has a rear port for receiving the third slurry output.
Dependencies are inferred from the claim text.